Compaq CL380 Memory technology evolution: an overview of system memory technol

Summary of contents

  • Abstract
  • Introduction
  • Basic DRAM operation
    • DRAM storage density and power consumption
    • Memory access time
    • Chipsets and system bus timing
    • Memory bus speed
    • Burst mode access
  • SDRAM technology
    • Bank interleaving
    • Increased bandwidth
    • Registered SDRAM modules
    • DIMM Configurations
      • Single-sided and double-sided DIMMs
      • Single-rank, dual-rank, and quad-rank DIMMs
      • Rank interleaving
    • Memory channel interleaving
  • Advanced memory technologies
    • Double Data Rate SDRAM technologies
      • DDR-1
        • Prefetching
        • Double transition clocking
        • SSTL_2 low-voltage signaling technology
        • Stobe-based data bus
        • DDR-1 DIMMs
        • Backward compatibility
      • DDR-2
      • DDR-3
      • Module naming convention and peak bandwidth
    • Fully-Buffered DIMMs
      • FB-DIMM architecture
      • Challenges
    • Rambus DRAM
  • Importance of using HP-certified memory modules in ProLiant
  • Conclusion
  • For more information
  • Call to action
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